US Patent Issued to Semes on Oct. 28 for "Substrate treating apparatus and substrate treating method" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,643, issued on Oct. 28, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea).

"Substrate treating apparatus and substrate treating method" was invented by Youngjun Son (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treating apparatus includes a support plate having a first decompression hole and a second decompression hole in a first surface facing a substrate and including a first decompression flow path connected to the first decompression hole and a second decompression flow path connected to the second decompression hole, a plurality of movable pins protruding from the first surface of the support ...