ALEXANDRIA, Va., June 10 -- United States Patent no. 12,290,876, issued on May 6, was assigned to Semes Co. Ltd. (Cheonan-si, South Korea).
"Film removing method, substrate treating method, and substrate treating apparatus" was invented by Soo Young Park (Incheon, South Korea), Ohyeol Kwon (Cheonan-si, South Korea), Jun Keon Ahn (Sejong-si, South Korea), Jung Hwan Lee (Pyeongtaek-si, South Korea) and Seong Soo Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of ...