ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,699, issued on May 27, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treating apparatus and substrate treating method" was invented by Yoon Jong Ju (Hwaseong-si, South Korea), Seong Gil Lee (Hwaseong-si, South Korea), Jae Hwan Kim (Gwangmyeong-si, South Korea), Wan Jae Park (Hwaseong-si, South Korea), Hye Joon Kheel (Hwaseong-si, South Korea), Ji Hoon Park (Suwon-si, South Korea) and Young Je Um (Busan, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a substrate treating method, including: a first treatment operation of treating the substrate by using first plasma generated by e...