ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,219, issued on May 20, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Substrate treating method and substrate treating apparatus" was invented by Seong Gil Lee (Hwaseong-si, South Korea), Myoung Sub Noh (Hwaseong-si, South Korea), Dong-Hun Kim (Seoul, South Korea), Young Je Um (Busan, South Korea), Dong Sub Oh (Busan, South Korea), Jun Taek Koo (Seoul, South Korea) and Wan Jae Park (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treating method includes a temperature stabilizing step for stabilizing a temperature of the substrate to a process temperature in a treating space for treating a substrate, a...