US Patent Issued to SEMES on June 3 for "Wafer expander for uniformly expanding gap between dies, and die supplying module and die bonding equipment including same" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,614, issued on June 3, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).

"Wafer expander for uniformly expanding gap between dies, and die supplying module and die bonding equipment including same" was invented by Do Youn Lim (Hwaseong-si, South Korea), Kuk Saeng Kim (Yongin-si, South Korea) and Wan Hee Jeong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between...