US Patent Issued to SEMES on June 17 for "Guide unit, transfer assembly and die bonding apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,381, issued on June 17, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).

"Guide unit, transfer assembly and die bonding apparatus including the same" was invented by Do-Youn Lim (Hwaseong-si, South Korea), Yeon Hyuk Jung (Cheonan-si, South Korea), Eung Seok Kim (Cheonan-si, South Korea) and Byoung Ho Jung (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a transfer assembly. The transfer assembly includes a transfer robot configured to take out the transfer object stored at the cassette and to transfer in a first direction to the target position; and a guide unit providing a transfer pass...