US Patent Issued to SEMES on June 10 for "Die surface treatment apparatus and die bonding system including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,810, issued on June 10, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).

"Die surface treatment apparatus and die bonding system including the same" was invented by Min Young Kim (Gyeonggi-do, South Korea), Hang Lim Lee (Chungcheongnam-do, South Korea) and Ji Hoon Park (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a die surface treatment apparatus capable of sequentially performing reduction and activation processes on dies in a dual zone and a die bonding system including the die surface treatment apparatus. The die surface treatment apparatus includes: a stage supporting dies, a first p...