ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,694, issued on July 1, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Method and apparatus for treating substrate" was invented by Dong-Hun Kim (Seoul, South Korea), Jae Hwan Kim (Gwangmyeong-si, South Korea), Hye Joon Kheel (Hwaseong-si, South Korea), Gun Woo Kim (Incheon, South Korea) and Tae Hyeon Jeon (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate treating method of removing a thin film formed on a substrate. The substrate treating method includes a reaction process of transferring an etchant to the thin film, and a removal process of removing process by-products generated by reacting ...