ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,025, issued on Jan. 13, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea).
"Apparatus for treating substrate and method for treating a substrate" was invented by Jae Hong Kim (Chungcheongnam-do, South Korea), Hyeong Jun Cho (Seoul, South Korea), Sang Hyun Son (Busan, South Korea) and Sang Min Ha (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a method for treating a substrate. The method for treating a substrate comprises: a monitoring step of calculating a flow rate of a liquid, comparing the calculated measurement flow rate of the liquid with a set flow rate of the liquid in a n...