ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,204, issued on Feb. 17, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea).

"Nozzle and substrate treating apparatus including the same" was invented by Sunmi Kim (Jeollanam-do, South Korea) and Kyu Hwan Chang (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for treating a substrate includes a support unit that supports the substrate and a nozzle that dispenses liquid plasma to etch a film formed on the substrate supported on the support unit."

The patent was filed on July 1, 2021, under Application No. 17/365,020.

*For further information, including images, charts and tables, please visit: http://p...