ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,597, issued on Dec. 16, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea).
"Substrate treating apparatus and method thereof" was invented by Hong Joo Lee (Chungcheongnam-do, South Korea) and Moo Hyung Yi (Chungcheongnam-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides substrate processing apparatus and a substrate processing method for composing nozzles having different drop sizes into one or more pack units and performing pixel printing by using nozzles belonging to the thus composed packs. The substrate processing method includes extracting nozzles that have different drop sizes as differ...