ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,099, issued on Aug. 5, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Die ejecting apparatus for bonding equipment" was invented by Hee Cheol Lee (Pyeongtaek-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die ejecting apparatus includes an ejector body having a cylindrical shape, ejector pins provided inside the ejector body and configured to rise or fall, a hood coupled to an upper portion of the ejector body and made of a light-transmitting material in which through holes through which the ejector pins may pass are formed, and a reinforcement member disposed in a form of a mesh mounted on the hood and overlapping the t...