ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,950, issued on Aug. 12, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Transfer assembly and apparatus for treating a substrate with the transfer assembly" was invented by Su Bin Jeon (Cheonan-si, South Korea) and Duk Hyun Son (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treating apparatus is provided. The substrate treating apparatus includes an atmospheric pressure transfer module provided with a first transfer robot having a first hand with a substrate placed thereon; a vacuum transfer module provided with a second transfer robot having a second hand with a substrate placed thereon; a load-lock c...