ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,130, issued on April 15, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Substrate storing and aligning apparatus in substrate bonding equipment for bonding substrates to each other" was invented by Ho Cheon Bang (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate storing and aligning apparatus is proposed. The substrate storing and aligning apparatus is capable of efficiently using space in substrate bonding equipment. The substrate storing and aligning apparatus in the substrate bonding equipment for bonding substrates includes a front end buffer including a front end storing slot configured to temporarily st...