ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,716, issued on Jan. 28, was assigned to Semes Co. Ltd. (Cheonan-si, South Korea) and SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Substrate processing apparatus and substrate processing method" was invented by Jaeseong Lee (Hwaseong-si, South Korea), Kihoon Choi (Cheonan-si, South Korea), Hae-Won Choi (Daejeon, South Korea), Jihoon Jeong (Seongnam-si, South Korea), Seohyun Kim (Hwaseong-si, South Korea), Young-Hoo Kim (Yongin-si, South Korea), Sangjine Park (Suwon-si, South Korea) and Kuntack Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a chamber including an upper cham...