US Patent Issued to SEKISUI POLYMATECH on Nov. 11 for "Thermally conductive sheet and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,984, issued on Nov. 11, was assigned to SEKISUI POLYMATECH Co. LTD. (Saitama, Japan).

"Thermally conductive sheet and method for manufacturing same" was invented by Hiroki Kudoh (Kawaguchi, Japan) and Miho Ishihara (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet ...