ALEXANDRIA, Va., June 16 -- United States Patent no. 12,305,014, issued on May 20, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).
"Expanded particles and expanded molded article" was invented by Kohei Tazumi (Osaka, Japan), Daichi Kageyama (Osaka, Japan) and Mayumi Ando (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to expanded particles and an expanded molded article. More specifically, the present invention relates to expanded particles comprising a polycarbonate-based resin as a base resin, which has a specified cell density X and a specified average cell wall thickness, as well as an expanded molded article. In addition, the present invention relates to...