US Patent Issued to SEKISUI KASEI on Jan. 27 for "Hollow resin particle and method for producing same" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,600, issued on Jan. 27, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Hollow resin particle and method for producing same" was invented by Haruhiko Matsuura (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a hollow resin particle that can reduce the dielectricity and dielectric loss tangent of a resin layer by introducing an empty area thereinto, and can be obtained by forming a hollow portion in a simple manner. Also provided is a method of producing such hollow resin particle in a simple manner. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell...