US Patent Issued to SEKISUI KASEI on April 22 for "Laminate, laminate with buildup layer, laminate with metal foil, and circuit board" (Japanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,755, issued on April 22, was assigned to SEKISUI KASEI Co. LTD. (Osaka, Japan).

"Laminate, laminate with buildup layer, laminate with metal foil, and circuit board" was invented by Koichiro Okamoto (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a laminate and the like and a circuit board including the same that exhibit an excellent low dielectric property by a non-conventional new approach. The laminate according to an embodiment of the present invention is a laminate used for a core layer of a circuit board, in which the laminate does not include a buildup layer, the laminate is obtained by laminating a plurality of ...