US Patent Issued to SEKISUI CHEMICAL on Nov. 4 for "Resin composition for molding and molded article" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,075, issued on Nov. 4, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Resin composition for molding and molded article" was invented by Tomohiro Horinouchi (Yamaguchi, Japan), Mitsuo Matsumoto (Yamaguchi, Japan), Ryota Yamasugi (Yamaguchi, Japan), Yoshito Arai (Osaka, Japan), Yasunari Kusaka (Osaka, Japan) and Nami Nakajima (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article inclu...