US Patent Issued to SEKISUI CHEMICAL on Nov. 18 for "Heat transfer sheet, method for producing heat transfer sheet, heat transfer sheet package, and method for producing heat transfer sheet package" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,592, issued on Nov. 18, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Heat transfer sheet, method for producing heat transfer sheet, heat transfer sheet package, and method for producing heat transfer sheet package" was invented by Keisuke Mukasa (Shimotsuke, Japan), Yusuke Kubo (Shimotsuke, Japan) and Keisuke Aramaki (Shimotsuke, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat transfer sheet includes: at least one of a carbon fiber and a boron nitride flake; an inorganic filler, and a binder resin. The at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the heat transfer shee...