US Patent Issued to SEKISUI CHEMICAL on Jan. 20 for "Ink-jet adhesive, method for producing electronic component, and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,956, issued on Jan. 20, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Ink-jet adhesive, method for producing electronic component, and electronic component" was invented by Yoshifumi Sugisawa (Osaka, Japan), Takashi Watanabe (Osaka, Japan), Mitsuru Tanikawa (Osaka, Japan), Yusuke Fujita (Osaka, Japan), Taichi Hamada (Osaka, Japan) and Tomoya Tanaka (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an ink-jet adhesive that can suppress adhesion of an adhesive component to an unintended region of a transparent member when the transparent member is used as a member to be bonded. The ink-jet adhesive according to the ...