ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,612, issued on Dec. 30, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Adhesive composition, adhesive tape, and method for processing electronic component" was invented by Tokushige Shichiri (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300deg C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition inc...