ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,629, issued on April 29, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).
"Conductive particles and connection structure" was invented by Yuto Dobashi (Shiga, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive particle including a base particle and a conductive portion disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 micro metre or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after...