ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,551, issued on Sept. 23, was assigned to Seiko Epson Corp. (Tokyo).
"Liquid ejecting head and liquid ejecting apparatus" was invented by Fumiya Takino (Shiojiri, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A head chip that includes a nozzle plate having a plurality of nozzles configure to eject a liquid, another member different from the head chip, an adhesive that bonds the head chip and the other member, and a heating element configured to plasticize the adhesive are provided."
The patent was filed on Oct. 2, 2023, under Application No. 18/479,734.
*For further information, including images, charts and tables, please visit: http://patf...