ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,206, issued on Sept. 16, was assigned to SEIKO EPSON Corp. (Tokyo).
"Ultrasonic device" was invented by Hiroshi Matsuda (Gifu, Japan) and Kanechika Kiyose (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic sensor includes: a first substrate including an ultrasonic element; a first electrode and a second electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface; and a gap material that separates the first substrate and the second substrate from each other, in which in a plan view from a +Z direction, the through-hole overl...