ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,671, issued on Oct. 21, was assigned to Seiko Epson Corp. (Tokyo).
"Three-dimensional shaping method" was invented by Keitaro Hashizume (Shiojiri, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional shaping method of shaping a three-dimensional shaped article using a first material including first resin and a second material including second resin having a heat shrinkage rate different from a heat shrinkage rate which the first resin has, the method including stacking, when preparing a first slice layer formed of one of the first material and the second material, and stacking a second slice layer formed of another of the first m...