US Patent Issued to SEIKO EPSON on Nov. 25 for "Thixomolding material and method of manufacturing thixomolding material" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,021, issued on Nov. 25, was assigned to SEIKO EPSON Corp. (Japan).

"Thixomolding material and method of manufacturing thixomolding material" was invented by Shunsuke Uchizono (Shiojiri, Japan), Yasutoshi Hideshima (Matsumoto, Japan), Setsuya Iwashita (Nirasaki, Japan), Tetsuhiko Takeuchi (Shimosuwa, Japan) and Fumiya Maeda (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thixomolding material includes: a metal body containing magnesium(Mg) as a primary component; a plurality of coating particles provided at a front surface of the metal body and having an average particle diameter equal to or less than 100 micro metre, the plurality...