US Patent Issued to Seiko Epson on Nov. 25 for "Method for manufacturing three-dimensional shaped object having an absorption unit configured to temporarily absorb shaping material" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,164, issued on Nov. 25, was assigned to Seiko Epson Corp. (Tokyo).

"Method for manufacturing three-dimensional shaped object having an absorption unit configured to temporarily absorb shaping material" was invented by Wataru Endo (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing a three-dimensional shaped object that manufactures a three-dimensional shaped object by stacking layers using a three-dimensional shaping device. The method for manufacturing a three-dimensional shaped object includes: a first step of acquiring first shaping data including path information indicating a movement path of a ...