ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,688, issued on Nov. 18, was assigned to Seiko Epson Corp. (Tokyo).
"Three-dimensional molding device" was invented by Riona Toda (Shiojiri, Japan) and Kenta Anegawa (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional molding device includes: a stage; an ejection unit including a tip end portion in which a first nozzle hole and a second nozzle hole are formed adjacent to each other at a predetermined interval along a first axis, and configured to eject a material from the first nozzle hole and the second nozzle hole toward the stage; a position changing unit configured to change relative positions of the stage and the...