ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,286, issued on Nov. 11, was assigned to Seiko Epson Corp. (Tokyo).
"Molding management apparatus" was invented by Kosuke Atsuta (Nagano, Japan) and Hiroki Minowa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A molding management apparatus includes an operation section as a selection section that selects an objective variable, a correlation calculation section that calculates a correlation between time series data corresponding to an objective variable and a plurality of time series data sets corresponding to explanatory variables describing the objective variable, and a display section for displaying a plurality of time series data s...