US Patent Issued to SEIKO EPSON on May 6 for "Molding machine management system and computer program" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,731, issued on May 6, was assigned to SEIKO EPSON Corp. (Japan).

"Molding machine management system and computer program" was invented by Yoshiaki Otsuki (Matsumoto, Japan), Ko Tsukada (Matsumoto, Japan) and Yusuke Mitsuma (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding machine management system includes: an injection molding machine including a mold, an injection unit, and a mold clamping unit; a management server coupled to the injection molding machine via a network; a first camera configured to capture an image of the mold; a second camera configured to capture an image of a drive unit provided in the injection molding ...