ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,437, issued on May 27, was assigned to SEIKO EPSON Corp. (Tokyo).
"Thixomolding material" was invented by Yasutoshi Hideshima (Matsumoto, Japan), Setsuya Iwashita (Nirasaki, Japan), Fumiya Maeda (Azumino, Japan), Shunsuke Uchizono (Shiojiri, Japan), Koichi Ozaki (Okayama, Japan) and Tadao Fukuta (Kurashiki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the...