ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,590, issued on May 27, was assigned to SEIKO EPSON Corp. (Japan).
"Molding machine management device" was invented by Kosuke Atsuta (Shiojiri, Japan) and Hiroki Minowa (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A molding machine management device that is able to couple to a molding machine includes a storage unit configured to store, in chronological order, numerical value information on a molding process when a molded product is molded by the molding machine and four-factor information on four factors of production which includes a man, a machine, a material, and a method when the molded product is produced, and an output cont...