ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,587, issued on May 27, was assigned to SEIKO EPSON Corp. (Japan).
"Injection molding device and molding tool" was invented by Takuro Fushimi (Matsumoto, Japan) and Hiroyuki Kato (Shiojiri, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding device includes a stationary mold provided with a first gate opening, and a second gate opening, a movable mold configured to be mold-clamped against the stationary mold, a first hot runner configured to inject a first molding material in a cavity compartmented by the stationary mold and the movable mold, via the first gate opening, a second hot runner configured to inject a second molding m...