ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,150, issued on May 20, was assigned to Seiko Epson Corp. (Tokyo).
"Three-dimensional molding device" was invented by Taki Hashimoto (Nagano, Japan) and Masayuki Gozu (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional molding device includes: a molding unit including a nozzle configured to eject a molding material from a nozzle opening formed in a distal end portion; a stage having a deposition surface on which the molding material is deposited; a movement mechanism configured to change relative positions of the nozzle and the stage; a measurement unit configured to measure a distance between the deposition surface and ...