ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,991, issued on July 1, was assigned to SEIKO EPSON Corp. (Japan).
"Processing method and processing apparatus" was invented by Hideki Okada (Shiojiri, Japan), Hirokazu Sekino (Chino, Japan) and Osamu Katsuda (Matsumoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing method includes: a liquid ejecting step of ejecting liquid toward a fabric from an ejecting nozzle hole of a liquid ejecting section and causing the liquid to strike the fabric, the liquid ejecting section including at least one nozzle, the at least one nozzle including the ejecting nozzle hole and a liquid inflow port serving as an inlet to the ejecting nozzle hole; an...