ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,790, issued on Jan. 13, was assigned to SEIKO EPSON Corp. (Tokyo).
"Thixomolding material" was invented by Shunsuke Uchizono (Shiojiri, Japan), Setsuya Iwashita (Nirasaki, Japan), Yasutoshi Hideshima (Matsumoto, Japan), Fumiya Maeda (Azumino, Japan), Koichi Ozaki (Okayama, Japan) and Tadao Fukuta (Kurashiki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the meta...