US Patent Issued to SEIKO EPSON on Feb. 3 for "Molding stage and three-dimensional molding apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,668, issued on Feb. 3, was assigned to SEIKO EPSON Corp. (Japan).

"Molding stage and three-dimensional molding apparatus" was invented by Keitaro Hashizume (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding stage includes a base which includes a molding surface, in which a first through hole penetrating the base along a first intersecting axis crossing a vertical axis perpendicular to the molding surface and a second through hole penetrating the base along a second intersecting axis crossing the vertical axis and the first through hole are formed, a first slide member which is inserted into the first through hole, and which is ...