US Patent Issued to SEIKO EPSON on Feb. 3 for "Molding material production method and molding material" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,199, issued on Feb. 3, was assigned to SEIKO EPSON Corp. (Japan).

"Molding material production method and molding material" was invented by Atsushi Yamada (Chino, Japan), Shinobu Yokokawa (Okaya, Japan), Hirofumi Hokari (Chino, Japan) and Hajime Kakishita (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding material production method according to the present disclosure includes an acylation step of conducting acylation reaction of cellulose, while irradiating, with microwaves of 0.4 GHz or more and 6.0 GHz or less, a mixture including the cellulose, an acylation agent, and a solvent, in which the solvent is an ionic liquid or a l...