US Patent Issued to Seiko Epson on Feb. 3 for "Method for manufacturing molding die, and molding die" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,666, issued on Feb. 3, was assigned to Seiko Epson Corp. (Tokyo).

"Method for manufacturing molding die, and molding die" was invented by Tatsuya Tsuboi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a molding die used with an injection molder, the method including plasticizing a creating material containing metal particles and resin to produce a plasticized material, and dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die, with an average particle diameter D50 of the metal particles being smaller than or equal ...