US Patent Issued to Seiko Epson on Feb. 18 for "Material delivery device, three-dimensional shaping device, and injection molding device" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,226,941, issued on Feb. 18, was assigned to Seiko Epson Corp. (Tokyo).

"Material delivery device, three-dimensional shaping device, and injection molding device" was invented by Hiroki Kobayashi (Hara-Mura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material delivery device includes: a plasticization unit having a screw and configured to plasticize a material by rotation of the screw to produce a plasticized material; a flow path through which the plasticized material flows; a nozzle having a nozzle opening that communicates with the flow path and delivers the plasticized material to an outside; a cylinder coupled to the flow path; a rod ins...