US Patent Issued to SEIKO EPSON on Feb. 11 for "Three-dimensional shaping device and method for manufacturing three-dimensional shaped object" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,220,859, issued on Feb. 11, was assigned to SEIKO EPSON Corp. (Japan).

"Three-dimensional shaping device and method for manufacturing three-dimensional shaped object" was invented by Taki Hashimoto (Shiojiri, Japan), Kohei Yuwaki (Tsukuba, Japan) and Atsushi Majima (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional shaping device includes a plasticization unit configured to plasticize a material into a shaping material using a rotating screw; a drive unit configured to rotate the screw; a supply flow path through which the shaping material flows; a nozzle configured to discharge the shaping material; a discharge amount ...