US Patent Issued to SEIKO EPSON on Dec. 30 for "Injection molding system and method for controlling injection molding system" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,755, issued on Dec. 30, was assigned to SEIKO EPSON Corp. (Japan).

"Injection molding system and method for controlling injection molding system" was invented by Seijun Horie (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "As viewed in the vertical direction, in the injection molding system, a first distance, which is a distance between a first joint and a first placement section, a second distance, which is a distance between the first joint and a second placement section, and a third distance, which is a distance between the first joint and a robot wall section, are smaller than a fourth distance, which is a distance between the f...