US Patent Issued to Seiko Epson on Aug. 26 for "Three-dimensional modeling device, method of calibrating three-dimensional modeling device, and method of manufacturing three-dimensional shaped article" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,397,507, issued on Aug. 26, was assigned to Seiko Epson Corp. (Tokyo).

"Three-dimensional modeling device, method of calibrating three-dimensional modeling device, and method of manufacturing three-dimensional shaped article" was invented by Manabu Watanabe (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional modeling device includes a first ejection section configured to eject a first material, a second ejection section configured to eject a second material, a drive section configured to move each of the first ejection section and the second ejection section relatively to a stage, and a control section. The control sectio...