US Patent Issued to Seiko Epson on Aug. 19 for "Plasticizing device, injection molding apparatus, and three-dimensional shaping apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,390,968, issued on Aug. 19, was assigned to Seiko Epson Corp. (Tokyo).

"Plasticizing device, injection molding apparatus, and three-dimensional shaping apparatus" was invented by Hidenobu Maruyama (Azumino, Japan), Kazunobu Maruyama (Shiojiri, Japan) and Masato Sugano (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasticizing device includes a plasticizing mechanism including a feeding port for receiving a material and configured to plasticize the material to generate a melted material and a material feeding mechanism configured to feed the material to the plasticizing mechanism. The material feeding mechanism includes a housing incl...