US Patent Issued to SEIKO EPSON on April 8 for "Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,267, issued on April 8, was assigned to SEIKO EPSON Corp. (Japan).

"Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head" was invented by Motoki Takabe (Shiojiri, Japan) and Yu Shiozawa (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding substrate is provided with nozzle communication channels that establish communication between pressure chambers and nozzles. Each nozzle communication channel includes a pair of first inner wall surfaces constituting wall surfaces in a first direction, and a pair of second inner wall surfaces constituting wall surfaces in a second direction being ort...