US Patent Issued to SEIKO EPSON on April 8 for "Inspection method for injection molding device, test mold, and inspection system" (Japanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,199, issued on April 8, was assigned to SEIKO EPSON Corp. (Tokyo).

"Inspection method for injection molding device, test mold, and inspection system" was invented by Kakeru Sasagawa (Matsumoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inspection method for an injection molding device includes: a first step of acquiring a first detection value from a sensor using a test mold having the sensor, the sensor measuring a temperature or pressure of a molten material injected from a first injection molding device into a cavity section demarcated by a fixed mold and a moving mold; a second step of injecting a molten material from a second inje...