US Patent Issued to Seiko Epson on April 29 for "Injection molding machine management system" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,895, issued on April 29, was assigned to Seiko Epson Corp. (Tokyo).

"Injection molding machine management system" was invented by Hiroshi Nakamura (Nagano, Japan), Keiichi Enomoto (Nagano, Japan), Hayato Kobayashi (Higashichikuma-gun Yamagata-mura, Japan) and Masahiro Hatanaka (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An injection molding machine management system includes an injection molding machine, a first detecting section configured to detect at least one of a physical quantity of the injection molding machine and a physical quantity of a molded article, an on-premise server, and a Cloud server. The Cloud server includes a f...