US Patent Issued to SEIKO EPSON on April 15 for "Ultrasonic thickness measurement device and ultrasonic thickness measurement" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,274,583, issued on April 15, was assigned to SEIKO EPSON Corp. (Tokyo).

"Ultrasonic thickness measurement device and ultrasonic thickness measurement" was invented by Yoshio Arai (Shiojiri, Japan), Kanechika Kiyose (Matsumoto, Japan), Masahiro Onoda (Shimosuwa-machi, Japan) and Mio Sasaki (Shiojiri, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic thickness measurement device includes ultrasonic probe including eight or less ultrasonic elements each including a transmission element and a receiving element, the transmission element and the receiving element being an ultrasonic elements, and a controller configured to determine a thicknes...